发明名称 LEAK-FREE SEALING STRUCTURE OF A CERAMIC PACKAGE, LEAK-FREE CERAMIC PACKAGE AND FABRICATION METHOD OF THE CERAMIC PACKAGE
摘要 The invention provides a ceramic package, a ceramic package having such a sealing structure and a fabrication method of thereof. In the ceramic package, a wall layer made of a plurality of laminated ceramic sheets and having a cavity formed in a central portion thereof is stacked on a top of a base layer made of a plurality of laminated ceramic sheets. A metal layer is coated on the wall layer around the cavity to expose an outer peripheral portion of the wall layer. A glass layer is coated on the outer peripheral portion of the wall layer, which is not coated with the metal layer, to contact with the metal layer. A lid is attached on the metal layer to seal the cavity. The glass layer is coated around the metal layer, which is attached on the ceramic wall layer around the cavity, to reinforce the bonding force between the metal layer and the underlying ceramic wall layer thereby potentially preventing creation of cracks between the metal layer and the underlying ceramic wall layer.
申请公布号 KR100506738(B1) 申请公布日期 2005.08.08
申请号 KR20030077296 申请日期 2003.11.03
申请人 发明人
分类号 H01L23/02;H01L21/50;H01L21/60;H01L23/04;H01L23/10;H01L23/13 主分类号 H01L23/02
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