| 发明名称 |
Hermetic surface mounted power package |
| 摘要 |
A semiconductor package which includes a substrate formed from AIN and electrical terminals formed from tungsten on at least one surface of the substrate by bulk metallization to serve as electrical connection to a component within the package. <IMAGE> |
| 申请公布号 |
EP1560266(A2) |
申请公布日期 |
2005.08.03 |
| 申请号 |
EP20050001659 |
申请日期 |
2005.01.27 |
| 申请人 |
INTERNATIONAL RECTIFIER CORPORATION |
发明人 |
ZHUANG, WEIDONG |
| 分类号 |
H01L23/047;H01L23/057;H01L23/06;H01L23/08 |
主分类号 |
H01L23/047 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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