| 摘要 |
<p>A process for making a printed circuit board having a solder mask and area(s) of exposed metal circuitry which comprises the steps: a) applying a non-aqueous ink which is substantially free from organic solvent to a printed circuit board; b) curing the ink by exposure to actinic radiation; and c) optionally heating the ink; whereby the ink is applied to selected areas of the printed circuit board by means of an ink jet printer and wherein the ink comprises: i) a cationically curable compound; and ii) a cationic initiator.</p> |
