Support for an integrated circuit package having a column grid array interconnect

摘要

A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.