发明名称 Substrate transfer device
摘要 The present invention provides a vacuum stage device that moves a substrate to be processed in a vacuum environment. In a substrate transfer device in accordance with the present invention, a wafer mounted to a wafer platen is moved in a vacuum processing chamber. This substrate transfer device includes a first driving mechanism for moving the wafer platen in a Y 1 direction, and a second driving mechanism that is provided in the vacuum processing chamber and linearly reciprocates the wafer platen in X 1 and X 2 directions at a high speed.
申请公布号 US6925355(B2) 申请公布日期 2005.08.02
申请号 US20020228047 申请日期 2002.08.27
申请人 SUMITOMO HEAVY INDUSTRIES, LTD. 发明人 MORI HIDEHIKO;TOMITA YOSHIYUKI;SAKAKI KAZUTOSHI
分类号 G12B5/00;B65G49/07;F15B15/14;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):G06F7/00 主分类号 G12B5/00
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