发明名称 |
Substrate transfer device |
摘要 |
The present invention provides a vacuum stage device that moves a substrate to be processed in a vacuum environment. In a substrate transfer device in accordance with the present invention, a wafer mounted to a wafer platen is moved in a vacuum processing chamber. This substrate transfer device includes a first driving mechanism for moving the wafer platen in a Y 1 direction, and a second driving mechanism that is provided in the vacuum processing chamber and linearly reciprocates the wafer platen in X 1 and X 2 directions at a high speed.
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申请公布号 |
US6925355(B2) |
申请公布日期 |
2005.08.02 |
申请号 |
US20020228047 |
申请日期 |
2002.08.27 |
申请人 |
SUMITOMO HEAVY INDUSTRIES, LTD. |
发明人 |
MORI HIDEHIKO;TOMITA YOSHIYUKI;SAKAKI KAZUTOSHI |
分类号 |
G12B5/00;B65G49/07;F15B15/14;H01L21/027;H01L21/677;H01L21/68;(IPC1-7):G06F7/00 |
主分类号 |
G12B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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