发明名称 Semiconductor device and its manufacturing method
摘要 A semiconductor device and a method of manufacturing the semiconductor device are disclosed. A semiconductor device of one of several disclosed embodiments comprises a semiconductor layer having a source region and a drain region, and a gate insulating film provided on the semiconductor layer between the source region and the drain region. The gate insulating film comprising an oxide including a metal element and further includes at least one element selected from the group consisting of nitrogen and aluminum as a first element. The content of the first element is relatively higher at both ends near the source region and the drain region than at a center of the gate insulating film. A gate electrode is provided on the gate insulating film.
申请公布号 US6924536(B2) 申请公布日期 2005.08.02
申请号 US20030372963 申请日期 2003.02.26
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NISHIYAMA AKIRA;INUMIYA SEIJI
分类号 H01L29/78;H01L21/265;H01L21/28;H01L21/316;H01L21/336;H01L29/51;(IPC1-7):H01L31/119 主分类号 H01L29/78
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