发明名称 Relay device and relay device mounting structure
摘要 Terminals ( 11, 13 ) for electrical connection respectively have front end portions ( 11 b, 13 b) to be joined to a wiring board ( 20 ) with solder and base end portions ( 11 a, 13 a) drawn outside from a cover ( 7 ) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil ( 5 ) by the deflection deformation of the intermediate portions ( 11 c, 13 c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of L' in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.
申请公布号 US6924964(B2) 申请公布日期 2005.08.02
申请号 US20020316026 申请日期 2002.12.11
申请人 YAZAKI CORPORATION 发明人 ASHIYA HIROYUKI;SUZUKI MASATAKA;TANAKA YOSHIYUKI;MATSUURA SHINGO
分类号 H05K3/34;H01H1/58;H01H45/04;H01H45/14;H01H50/14;H01H50/44;H05K1/18;H05K3/30;(IPC1-7):H01H47/00 主分类号 H05K3/34
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