发明名称 |
Through silicon via, folded flex microelectronic package |
摘要 |
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.
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申请公布号 |
US6924551(B2) |
申请公布日期 |
2005.08.02 |
申请号 |
US20030447493 |
申请日期 |
2003.05.28 |
申请人 |
INTEL CORPORATION |
发明人 |
RUMER CHRISTOPHER L.;ZARBOCK EDWARD A. |
分类号 |
H01L23/48;H01L23/498;H01L23/538;H01L25/065;(IPC1-7):H01L23/48;H01L23/52;H01L23/34;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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