发明名称 |
Integrated circuit device installed structure and installation method |
摘要 |
A packaging structure suitable for an integrated circuit device receiving short-wavelength laser light is provided. The integrated circuit device having a photo detecting part, leads and wires for connection therebetween are encapsulated in an encapsulation section. A recess is formed on the light incident surface of the encapsulation section above the photo detecting part, to thin the encapsulation section on the surface of the photo detecting part and thereby reduce the energy of light absorbed by the encapsulation section.
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申请公布号 |
US6924540(B2) |
申请公布日期 |
2005.08.02 |
申请号 |
US20030388617 |
申请日期 |
2003.03.17 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SHIRAKAWA YASUFUMI;TANIGUCHI MASAKI;FUKUDA HIDEO;SHIMIZU YUZO;ESAKI SHINYA |
分类号 |
G11B7/13;G11B7/24;H01L21/50;H01L21/56;H01L23/02;H01L23/28;H01L23/50;H01L27/14;H01L31/02;H01L31/0203;H01L47/00;(IPC1-7):H01L31/020 |
主分类号 |
G11B7/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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