| 摘要 |
A process for the fabrication of devices that integrate protected microstructures, comprising the following steps: forming, in a body of semiconductor material, at least one microstructure having at least one first portion and one second portion which are relatively mobile with respect to one another and are separated from one another by at least one gap region, which is accessible through a face of the body; and sealing the gap. The sealing step includes depositing on the face of the body a layer of protective material, in such a way as to close the gap region, the protective layer being such as to enable relative motion between the first portion and the second portion of the microstructure.
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