Inkjet device encapsulated at the wafer scale

摘要

Micro-fabricated devices ( 152 ) is packaged at the wafer ( 150 ) stage with a cap ( 156, 160 ) applied to one or both sides of the wafer ( 150 ) prior to separation of the wafer into separate devices. The cap ( 156 ) on the top side overlays the respective device(s) ( 152 ), except the bond pads ( 158 ). The cap ( 160 ) on the bottom overlays all of the respective device(s) ( 152 ).