| 摘要 |
A method for producing an electronic element comprising a housing composed of an insulating ceramic substrate and a lid member covering a surface of the ceramic substrate, with at least one electronic element being mounted inside the housing. After preparing a plate-like ceramic substrate by baking a composite containing inorganic powders and a binder, the ceramic substrate is shaped in accordance with a predetermined design of the device, a metalized layer is formed on a surface of the shaped ceramic substrate, an electronic element is mounted in a predetermined area of the ceramic substrate, and the ceramic substrate is sealed with the lid member.
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