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发明名称
配线电路基板
摘要
用于黏着之配线电路基板的条状导体2之至少一特定部份系覆上阻焊剂3,其中该条状导体系经暴露以形成一条纹图样,使得个别导体可与电子组件之电极E连接。该特定部份系在具有一长末端的条状导体之纵向中之一区段,该区段系包含一与一电极重叠之区域,该电极系与一短末端连接且顺着条宽方向被平行转移到一具有一长末端的条状导体的位置上。结果,即使对于具有以高密度形成且呈锯齿状排列图样的电极之电子组件,也能够给配线电路基板提供一能够抑制在一电极与一配线图样之间的短路之结构,其系包含一与电极重叠之区域。
申请公布号
TW200525711
申请公布日期
2005.08.01
申请号
TW093138686
申请日期
2004.12.14
申请人
日东电工股份有限公司
发明人
西贤介;石丸康人
分类号
H01L23/12;H01L21/60
主分类号
H01L23/12
代理机构
代理人
洪武雄;陈昭诚
主权项
地址
日本
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