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发明名称
电子电路基板中间构件、其制造方法、其制造装置、非接触ID卡类之制造方法、及其装置
摘要
本发明系于载带2上,以每一定间隔只配置良品的插入式基板1,并且排除不良的插入式基板、空白部之坏影响于未然。
申请公布号
TW200525654
申请公布日期
2005.08.01
申请号
TW093140573
申请日期
2004.12.24
申请人
东丽工程股份有限公司
发明人
秋田雅典;佐吉记
分类号
H01L21/50;H01L25/00
主分类号
H01L21/50
代理机构
代理人
陈长文
主权项
地址
日本
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