| 摘要 |
A METHOD FOR PREPARING A COPPER PAD SURFACE FOR ELECTRICAL CONNECTION THAT HAS SUPERIOR DIFFUSION BARRIER AND ADHESION PROPERTIES IS PROVIDED. IN THE METHOD, A COPPER PAD SURFACE (14) IS FIRST PROVIDED THAT HAS BEEN CLEANED BY AN ACID SOLUTION, A PROTECTION LAYER (16) OF A PHOSPHORUS OR BORON-CONTAINING METAL ALLOY IS THEN DEPOSITED ON THE COPPER PAD SURFACE, AND THEN AN ADHESION LAYER (18) OF A NOBLE METAL IS DEPOSITED ON TOP OF THE PROTECTION LAYER. THE PROTECTION LAYER MAY BE A SINGLE LAYER, OR TWO OR MORE LAYERS INTIMATELY JOINED TOGETHER FORMED OF A PHOSPHORUS OR BORON-CONTAINING METAL ALLOY SUCH AS NI-P, CO-P, CO-W-P, CO-SN-P, NI-W-P, CO-B, NI-B, CO-SN-B, CO-W-B AND NI-W-B TO A THICKNESS BETWEEN ABOUT 1,000 Å AND ABOUT 10,000 Å. THE ADHESION LAYER CAN BE FORMED OF A NOBLE METAL SUCH AS AU, PT, PD AND AG TO A THICKNESS BETWEEN ABOUT 500 Å AND ABOUT 4,000 Å. |
