| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus to reduce growth formation on plated conductive leads. <P>SOLUTION: The method includes annealing one or more plated conductive leads at predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the method , and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the method. The plated conductive leads may be trimmed and formed prior to or after the anneal. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
