SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which can effectively dissipate the heat generated in the semiconductor light emitting element.

SOLUTION: The semiconductor light emitting device 1 is provided with a light emitting diode 3 and a heatsink 21. The light emitting diode 3 and the heatsink 21 are joined with a conductive bonding layer 13 such as solder. The conductive joining layer 13 is provided on a region surrounded by a peripheral region on the surface of an anode electrode 9 opposing to the main surface 21a of the heatsink 21. Moreover, the conductive joining layer 13 is formed so that the contact area with an anode electrode 9 becomes 60% or more but 98% or less of the surface area of the anode electrode 9 opposing to the main surface 21a of the heatsink 21. In addition, a cathode electrode 11 is arranged in the region to which the conductive joining layer 13 is reflected on the rear surface 5b of the substrate 5.

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