| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and a method for manufacturing the same device. <P>SOLUTION: This method for manufacturing a semiconductor device comprises a step for providing resin 40 between a wiring board 10 and a semiconductor chip 20; a step for diffusing gold 15 plated on a land 14 of a wiring pattern 12 installed on the wiring board 10 to solder arranged between the land 14 and an electrode 22 of the semiconductor chip 20, and for forming a conductive part 32 electrically connecting the land 14 to the electrode 22 so that the content of gold can exceed 30 wt.%; and a step for curing resin 40. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
