| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component plating method in which solution required for the electroless plating can be efficiently used. SOLUTION: The plating method comprises a step of arranging an electronic component (60) on a turnably supporting stand (22), a step of successively feeding a plurality of kinds of solutions required for the electroless plating to a surface (60a) of the electronic component on the supporting stand from a feed port (28a) formed above the supporting stand, and a step of allowing the solution fed to the surface of the electronic component to trickle with the surface and successively removing the solution from an outer edge of the electronic component by the turn of the supporting stand. COPYRIGHT: (C)2005,JPO&NCIPI
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