发明名称 |
Multiple die interconnect system |
摘要 |
A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circuit board (PCB) substrate with the secondary IC die residing between the base IC die and the PCB substrate.
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申请公布号 |
US2005161797(A1) |
申请公布日期 |
2005.07.28 |
申请号 |
US20050090613 |
申请日期 |
2005.03.25 |
申请人 |
FORMFACTOR, INC. |
发明人 |
MILLER CHARLES A. |
分类号 |
H01L25/18;H01L23/13;H01L23/498;H01L23/538;H01L25/065;H01L25/07;H05K7/10;(IPC1-7):H01L21/48;H01L23/52 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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