发明名称 STRUCTURE AND METHOD FOR PACKAGING MICRO STRAIN SENSORS
摘要 A micro strain sensor package generally comprising a sheet base and a sensor. The sheet base is configured for attachment to a substrate. An opening extends through the sheet base. The sensor has first and second anchors with at least one sensor element therebetween. The sensor is attached to the sheet base with the anchors positioned on opposite sides of the opening through the sheet base. The present invention further provides a method of securing a micro strain sensor package to a substrate.
申请公布号 WO2005068958(A1) 申请公布日期 2005.07.28
申请号 WO2005US00256 申请日期 2005.01.05
申请人 CASE WESTERN RESERVE UNIVERSITY;KO, WEN, H.;GUO, JUN;KUO, HUNG-I 发明人 KO, WEN, H.;GUO, JUN;KUO, HUNG-I
分类号 G01L1/14;G01L1/22;G01L5/00 主分类号 G01L1/14
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