发明名称 Semiconductor device and method of fabricating semiconductor device
摘要 To provide a semiconductor device which makes it possible to avoid deterioration in the step coverage property at a gate electrode provided on an operating region and decrease a leakage current between the operating region and the gate electrode. The semiconductor device arranged as a HEMT is made to include an operating region composed of multilayer films, such as a channel layer, an electron supplying layer and other semiconductor layer, and having an island structure independently mesa-isolated from one another. The semiconductor device also includes a gate electrode and an impurity diffusion layer provided on the surface of the operating region, the impurity diffusion layer being doped with an impurity having a conductivity type inverse to the impurity doped into the electron supplying layer.
申请公布号 US2005161705(A1) 申请公布日期 2005.07.28
申请号 US20050084163 申请日期 2005.03.21
申请人 SONY CORPORATION 发明人 KOBAYASHI JUNICHIRO
分类号 H01L21/28;H01L21/335;H01L21/338;H01L29/423;H01L29/778;H01L29/812;(IPC1-7):H01L29/739;H01L21/320 主分类号 H01L21/28
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