<p>A bonding tool for bonding a fine wire to bonding pads having a very fine pitch is disclosed. The bonding tool comprises a working tip (404) at an end thereof. The working tip includes an annular chamfer (413) formed at an inner portion of the end of the working tip, the inner annular chamfer having an angle (414) of less than about 60 degrees. The inner annular chamfer is coupled to a lower portion of a cylindrical passage formed (424) in the bonding tool.</p>
申请公布号
WO2005018864(B1)
申请公布日期
2005.07.28
申请号
WO2004US23657
申请日期
2004.07.22
申请人
KULICKE AND SOFFA INVESTMENTS, INC.;PERLBERG, GIL;BAHALUL, ARIE;MIRONESCU, DAN;AMSALEM, MOSHE;BRUNNER, JON
发明人
PERLBERG, GIL;BAHALUL, ARIE;MIRONESCU, DAN;AMSALEM, MOSHE;BRUNNER, JON