| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress leakage current and to enhance connection reliability between a mounting substrate and an integrated-circuit chip by forming the main part of the wiring board to be disclosed with an insulating layer. <P>SOLUTION: The wiring board 10 connects the mounting substrate 20 on a first-face side and mounts the integrated-circuit chip 30 on a second-face side which is the opposite side to the first-face side. The wiring board 10 is provided with an insulating layer 11, a wiring layer 12 formed in the insulating layer 11, and an electrically conductive connecting part 13 that is connected to the wiring layer 12 and is formed in the first-face side of the insulating layer 11 closer thereto as compared to the wiring layer 12. By using this wiring board 10, the mounting substrate 20 can be connected to the first-face side of the wiring board 10, while the integrated-circuit chip 30 can be mounted on the second-face side which is the opposite side to the first-face side, of the wiring board 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
