发明名称 LAMINATION CERAMIC ELECTRONIC COMPONENT AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a lamination ceramic electronic component wherein plating property of a underlying electrode and terminal strength are raised by preventing formation of an oxide film in the surface of the underlying electrode, and to provide the manufacturing method of the lamination ceramic electronic component which can improve productivity without increasing a cost while obtaining desired electrical property of a dielectric. SOLUTION: The component has a lamination body wherein a plurality of dielectric layers, and a plurality of inner conductors are laminated alternately; and an outer conductor which comprises an underlying conductor provided to the surface of the lamination body and a metallic layer provided on the underlying conductor, and is electrically connected to the inner conductor. The metallic element of the underlying conductor comprises at least one of Ni, and Ni alloy, and the ratio of the metallic element existing in the surface of the underlying conductor specified in the following formula (1) is 50 atomic % or more and 100 atomic % or less. The formula (1) is expressed by the ratio of the metallic element (atomic %) = ämetallic amount/(metallic amount + hydroxide amount of metal + oxide amount of metal)}×100. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005203566(A) 申请公布日期 2005.07.28
申请号 JP20040008384 申请日期 2004.01.15
申请人 MURATA MFG CO LTD 发明人 HONDA TSUNEHIRO;TONOGAKI TOMOHISA
分类号 H01G4/12;H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/12
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