| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive circuit device which allows the formation of fine patterns and rapid and continuous fabrication of reliable conductive circuit patterns, and which can be manufactured by a simplified process and is environmentally-friendly; and also to provide its manufacturing method. SOLUTION: The conductive circuit patterns are formed by applying a dispersion liquid containing metal grains having an average grain diameter of not less than 1 nm nor more than 200 nm on the surface of an insulating substrate having pores larger than the average grain diameter of the metal grains and then drying it. The conductive circuit patterns thus fabricated are formed with a metal plating layer. The diameter of the pores is 10 nm-10μm, and the depth in the vertical direction thereof is 1μm-30μm. The metal grains are coated from the inside of the pores of the insulating substrate over to the surface of the pores. On the surface of the insulating substrate, a continuous layer of coating film covering between the grains is formed between the pores. COPYRIGHT: (C)2005,JPO&NCIPI
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