| 摘要 |
PROBLEM TO BE SOLVED: To enable to control the film thickness for obtaining a desired thickness for a lower electrode, while realizing smoothness of the surface of the lower electrode which becomes a ground layer of an organic layer. SOLUTION: A lower electrode 12 which becomes a ground layer of the organic layer is formed on a substrate 11 so as to have at least a film-formed portion 12b formed on a polished surface 12a1. For this purpose, a forming process is adopted which at least includes a first film-forming process for forming a first film-formed portion 12a, a polishing process for polishing the surface of the film-formed portion 12a by the first film-forming process, and a second film-forming process for forming on the polished surface 12a1 formed by the polishing process. COPYRIGHT: (C)2005,JPO&NCIPI
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