发明名称 CIRCUIT BOARD ASSEMBLY AND METHOD OF ATTACHING A CHIP TO A CIRCUIT BOARD
摘要 An antenna array (100) is assembled by direct attaching a flip chip transmit/receive (T/R) module (1) to an antenna circuit board (2). A fillet bond (6) is applied to the circuit board (2) and the flip chip T/R module (1 ) around at least a portion of the periphery of the flip chip T/R module (1).< /SDOAB>
申请公布号 CA2538100(A1) 申请公布日期 2005.07.28
申请号 CA20052538100 申请日期 2005.01.13
申请人 RAYTHEON COMPANY 发明人 HAUHE, MARK S.;ROLSTON, KEVIN C.;WONG, TSE E.;FENGER, HAROLD S.;QUAN, CLIFTON
分类号 H01Q21/00;H01L23/00 主分类号 H01Q21/00
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