CIRCUIT BOARD ASSEMBLY AND METHOD OF ATTACHING A CHIP TO A CIRCUIT BOARD
摘要
An antenna array (100) is assembled by direct attaching a flip chip transmit/receive (T/R) module (1) to an antenna circuit board (2). A fillet bond (6) is applied to the circuit board (2) and the flip chip T/R module (1 ) around at least a portion of the periphery of the flip chip T/R module (1).< /SDOAB>
申请公布号
CA2538100(A1)
申请公布日期
2005.07.28
申请号
CA20052538100
申请日期
2005.01.13
申请人
RAYTHEON COMPANY
发明人
HAUHE, MARK S.;ROLSTON, KEVIN C.;WONG, TSE E.;FENGER, HAROLD S.;QUAN, CLIFTON