发明名称 PUNCHING METHOD AND PUNCHING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a punching device with simple configuration which can reduce detachment of a coated film on a workpiece, dust generation, and bending of metal foils constituting a current collector, and also to provide a method using the same. <P>SOLUTION: The punching method comprises punching the workpiece 9 fixed to a die with a punch using a punching die 1 equipped with the die 5, 7 and the punch 3, and the device using the same is provided. The workpiece is punched with the punch through a sheet member 17, so that working force applied to the workpiece is reduced and generation of bending of the foils on a cut surface of the workpiece is prevented. In addition the detachment of the coated film on the workpiece is prevented and dust or the like caused by the punching is prevented from adhering to the die. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005199381(A) 申请公布日期 2005.07.28
申请号 JP20040007796 申请日期 2004.01.15
申请人 TDK CORP 发明人 MIYAHARA KUNIO;SUZUKI KOICHI;ISHIKAWA YUJI;OTSUKA MASAYUKI;ENDO SEIICHI
分类号 B26D7/06;B26F1/40;H01G13/00;H01M4/139 主分类号 B26D7/06
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