| 摘要 |
PROBLEM TO BE SOLVED: To realize a micro testpiece processing and observation device in which cross-sectional observation and analysis of the wafer cross-section from horizontal to vertical direction can be made in high resolution and high precision with a high throughput, without splitting in pieces the wafer being a testpiece, and a micro testpiece processing and observation method. SOLUTION: The micro testpiece processing and observation device are equipped with a focused ion beam optical system and an electron optical system in an identical vacuum device, and separate a micro testpiece including the desired region of the testpiece by a charged particle beam forming process, and have a probe for sampling the micro testpiece separated. COPYRIGHT: (C)2005,JPO&NCIPI
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