| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a plated layer, which inhibits defects such as pits from occurring in the plated layer, and to provide a method for manufacturing a connecting device, which further inhibits the defects from occurring in the part of a spring layer out of the plated layer and improves spring characteristics. SOLUTION: This manufacturing method comprises: forming a lower electroconductive layer 42 made of Au or the like on a roughened surface 40a of a Cu substrate 40 by plating; forming a primarily plated layer 43 made of Ni or the like on the lower electroconductive layer 42 by electroplating at a low-current density; and forming a major plated layer 44 made of Ni or the like on the surface 43a leveled to some extent by electroplating at a high current density. Then, the method can inhibit defects such as pits from occurring on the major plated layer 44, make the Young's modulus of the major plated layer 44 higher than that of the other plated layers, and manufacture a spiral contact shoe 20 superior in spring characteristics. COPYRIGHT: (C)2005,JPO&NCIPI
|
