| 摘要 |
PROBLEM TO BE SOLVED: To provide a plating method for forming a plated film with uniform thickness on a substrate surface to be electroplated, and to provide a plating apparatus therefor. SOLUTION: The plating apparatus 1 comprises: an opening 2b provided in the bottom 2a of a plating tank 2; a cathode 3 arranged along the periphery of the opening 2b; a wafer holder 5 up-and-down-movably installed in a lower side of a bottom face of the plating apparatus 1; a supply port 7 and an exhaust port 8 for a plating liquid 6 arranged in the foot of a side wall of the plating tank 2; an anode 11 of the counter electrode of a cathode 3 stored in an anode box 9 which is fixed in the upper part of the plating tank 2; a direct current power supply connected to the cathode 3 and the anode 11 and arranged between them; a pair of electrode wires 15 and 16 for passing a feeble current of an ancillary current to the plating liquid 6, arranged in the plating tank 2 and further a paddle 10 for stirring the plating liquid 6 arranged therein; and a flat plate 13 arranged in the bottom 2a of the plating tank 2, which is freely movable with respect to a lower position of the opening 2b while the wafer holder 5 is moving down. COPYRIGHT: (C)2005,JPO&NCIPI
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