METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a semiconductor device with a thin sheet type semiconductor wafer accompanied by plating treatment as a base in such a manner that the failure of the thin sheet type wafer in the plating treatment is evaded. SOLUTION: The method of manufacturing each semiconductor device (10) provided with a plating layer (6) comprises: a step where a semiconductor wafer (5) in which a plurality of circuit patterns (2, 4) of the semiconductor device (10) are arranged on at least either side is prepared; a step where the wafer (5) is diced into a plurality of chips (10) each provided with the prescribed circuit patterns; and a step where a plating layer (6) is formed on at least either surface of each chip (10). COPYRIGHT: (C)2005,JPO&NCIPI