| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein it is impossible to convey a wafer by an air suction system and it is difficult to work the wafer in a succeeding process because of that when nickel plating is applied to a wafer, a nickel film shrinks, thus shrinkage stress is applied to an electrode part in a base material tightly stuck thereto to cause the warpage of the wafer. SOLUTION: Molybdenum is added to an electroless nickel bath, and molybdenum is precipitated into a deposited nickel film, thus the generation of internal stress in the film is suppressed, and the warpage of a wafer can be stopped. The stress is large after heat treatment compared with that in plating, but, by incorporating molybdenum into the nickel film, it is effective also on heat treatment. COPYRIGHT: (C)2005,JPO&NCIPI
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