| 摘要 |
Integrated circuit arrangement, in which bearing areas of mutually opposing sides of a carrier and of a substrate layer, which carries circuit structures, are bonded by means of an adhesive layer. The adhesive bond is produced from adhesives forming at least two adhesive tracks. The first adhesive track is formed in a region of an externally accessible seam between the substrate layer and the carrier, and the second adhesive track is formed parallel to the first adhesive track in an inner region of the bearing areas that face one another. |
