HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

摘要

Provided are a hybrid integrated circuit device and a manufacturing method of the same, in which it is capable of molding while fixing a position of a board in a cavity. A method for manufacturing a hybrid integrated circuit device includes the steps of: forming an electric circuit which includes a conductive pattern formed on a surface of a circuit board, and a circuit element electrically connected to the conductive pattern; fixing a tip portion of a lead to a pad formed of the conductive pattern disposed along a side of the circuit board, the tip portion being fixed approximately perpendicularly to a surface direction of the circuit board; housing the circuit board in a cavity of molds, and allowing a rear surface of the circuit board to abut with a bottom of the cavity by clamping the lead between the molds; and performing sealing by filling inside of the cavity with a sealing resin to expose the rear surface of the circuit board to the outside.