| 摘要 |
PROBLEM TO BE SOLVED: To provide a secondary battery packed with resin in which the resin is smoothly supplied without raising temperature and pressure of the resin injected and without making small the protection circuit substrate, and generation of a gap and a pin hole is prevented in all the spacing where the resin molding is formed. SOLUTION: This is the secondary battery in which a protection circuit substrate 300 is jointed with a gap to at least one side face of a bare cell 100 which comprises a can 211 of vessel type, an electrode assembly 212 built in through an aperture part of the can 211, and a cap assembly for sealing the can 211, and a resin mold is formed on the surface of the gap and the protection circuit substrate 300. A communicating means for communicating the resin mold filled in the gap and the resin mold covering the surface of the protection circuit substrate 300, for example, an open hole 330 is provided. COPYRIGHT: (C)2005,JPO&NCIPI |
