Printed circuit board, method and apparatus for fabricating the same, wiring circuit pattern, and printed wiring board

摘要

A wiring circuit pattern of this invention is formed by forming a resin resist pattern film on a conductor layer of a base of a printed circuit board in which at least an insulating layer and the conductor layer are stacked on at least one surface of the base, and performing wet etching by using the formed resin resist pattern film as an etching resist, wherein the width of the top of the wiring circuit pattern is larger than the width of its bottom.