| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a semiconductor device using an adhesive film for semiconductors capable of adhering a wafer and an adhesive at low temperature and capable of adhering a semiconductor element and a support member for mounting a semiconductor element, such as a lead frame, at low temperature. SOLUTION: The adhesive is coated with a carrier film for applying the adhesive to the wafer together with the carrier film, further applying it to a dicing sheet 6 together with the carrier film for being broken into pieces of semiconductor elements, and separating the carrier film and an adhesive layer for joining the semiconductor element and the support member 8 for mounting the semiconductor element. COPYRIGHT: (C)2005,JPO&NCIPI |
