| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for cutting a wafer for cutting a wafer by detecting a cut groove formed by a cutting blade while it is determined whether or not the wafer is completely cut. SOLUTION: In the method for cutting the wafer, the wafer attached to a dicing tape and adhered to the dicing tape is cut by the cutting blade. This method comprises the wafer retaining step of retaining the wafer to a chuck table; the alignment step of detecting a region to be cut by the wafer retained in the chuck table; the cutting step of positioning the cutting blade in the region to be cut by the wafer at a cut-in depth reaching the dicing tape, relatively moving the cutting blade and the chuck table in a range that the cutting blade does not reach a dicing frame beyond an outer fringe of the wafer, and cutting; and the cut groove detecting step of positioning the dicing tape exposed between the wafer and the dicing frame to an imaging region of an imaging means, imaging the dicing tape by the imaging means, and detecting whether or not the cut groove is formed in the dicing tape. COPYRIGHT: (C)2005,JPO&NCIPI |
