| 摘要 |
In a semiconductor device such as a chip having both of an analog circuit and a digital circuit, each of a first power supply wiring ( 20 ) for supplying power to an I/O circuit (digital circuit) positioned in the semiconductor device and a third power supply wiring ( 30 ) for supplying power to an internal circuit ( 300 ) such as an analog circuit formed as a cell, which is a power supply wiring connected to the power supply wiring ( 20 ) and positioned in the semiconductor chip ( 200 ), is formed from a structure of a multilayer wiring. This lowers the synthesized impedance of these power supply wirings ( 20, 30 ) and reduces the influence of power supply noise resulting from the operation of the digital circuit on the analog circuit within the semiconductor chip.
|
