发明名称 |
Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same |
摘要 |
The invention is intended for providing a semiconductor package structure which prevents degradation in characteristics of a semiconductor device, and breakage of interconnections, when the semiconductor device is packaged on a circuit substrate. In the package structure having the semiconductor device mounted on the circuit substrate, bump electrodes of the semiconductor device are placed on input/output terminal electrodes of the circuit substrate and are electrically and mechanically connected thereto by bonding with a conductive adhesive, and the semiconductor device is bonded and fixed to the circuit substrate by a resin film formed previously on a surface of a main body of the circuit substrate. The structure does no damage to a semiconductor functional part and to interconnections, and allows mounting with a lower load as compared to structures using conventional anisotropic conductive films and the like.
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申请公布号 |
US2005163982(A1) |
申请公布日期 |
2005.07.28 |
申请号 |
US20050039778 |
申请日期 |
2005.01.24 |
申请人 |
ONO MASAHIRO;SHIRAISHI TSUKASA |
发明人 |
ONO MASAHIRO;SHIRAISHI TSUKASA |
分类号 |
H01L21/56;H01L21/60;H01L23/498;H05K3/32;(IPC1-7):B32B3/00 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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