发明名称 Semiconductor component comprising an integrated latticed capacitance structure
摘要 An insulating layer which is produced on a semiconductor substrate has a capacitance structure produced in it. The capacitance structure has at least one first substructure which has a metal latticed region and electrically conductive regions which are arranged in the cutouts in the metal latticed region, the metal latticed region are electrically connected to a first connecting line, and the electrically conductive regions are electrically connected to a second connecting line.
申请公布号 US2005161725(A1) 申请公布日期 2005.07.28
申请号 US20050511855 申请日期 2005.03.29
申请人 DA DALT NICOLA 发明人 DA DALT NICOLA
分类号 H01G4/30;H01G4/33;H01G4/38;H01L21/02;H01L21/822;H01L23/522;H01L27/04;H01L27/08;(IPC1-7):H01L27/108 主分类号 H01G4/30
代理机构 代理人
主权项
地址