Conductive sintered compact for fixing electrodes in electronic device envelope

摘要

A conductive sintered compact for fixing electrodes inside an electronic device envelope is provided. The sintered compact is made of a conductive composition calcined. The conductive composition includes at least 10 vol % to 60 vol % of Ag particles, a low melting-point glass containing 10 vol % to 80 vol % of B₂O₃, 0 vol % to 70 vol % of ceramic particles, and a metal oxide series pigment. The total amount of the ceramic particles and the metal oxide series pigment is at least 10 vol % or more.