发明名称 Thermal plastic deformation of RF MEMS devices
摘要 A method of manufacturing an RF device including, in one embodiment, forming a deformable conductor over a substrate and plastically deforming the conductor via exposure to thermal energy to tune an electrical characteristic of the RF device. In another embodiment, the deformable conductor may also be elastically deformed to tune the electrical characteristic.
申请公布号 US2005162806(A1) 申请公布日期 2005.07.28
申请号 US20040850904 申请日期 2004.05.20
申请人 ZYVEX CORPORATION 发明人 SARKAR NEIL;GEISBERGER AARON
分类号 B81B3/00;H01G7/00;H01L27/14;(IPC1-7):H01G7/00 主分类号 B81B3/00
代理机构 代理人
主权项
地址