| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor device that perform stage processing while conveying a semiconductor device to make a conveying mechanism small-sized and lightweight, are adaptive to miniaturization of the semiconductor device, and has high operation efficiency and productivity. SOLUTION: Two processing mechanism parts which are a position correcting device 3a and an outward shape inspecting device 3b are combined and provided at a 1st stop position T<SB>3</SB>of a stage processing mechanism 3. Further, an electric characteristic inspecting device 3c is provided at the 2nd stop position T<SB>5</SB>of the stage processing mechanism 3. Position correction as a stage whose processing time is short and outward shape inspection are combined as a stage process group, and two stages are performed for the semiconductor device S at one stop position of the conveying mechanism 1 to decrease stop positions of the conveying mechanism 1. Further, an electric characteristic inspecting device 3c is provided independently which performs electric characteristic inspection whose processing time is long, and a position correcting device 3a performing the position correction whose processing time is short and an outward shape inspecting device 3b which performs the outward shape inspection are combined and provided to shorten the total processing time. COPYRIGHT: (C)2005,JPO&NCIPI
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