| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for manufacturing an electric apparatus high in connection reliability. SOLUTION: In the adhesive film, a second resin layer 20 is formed on the surface of a first resin layer 10, a third resin layer 25 is formed on the back surface of the first resin layer 10, and the lowest viscosity in a temperature region lower than the connection temperature of the first resin layer 10 is made to be higher than the lowest viscosity in a temperature region lower than the connection temperatures of the second resin layer 20 and the third resin layer 25. Accordingly, when the adhesive film 4 is nipped by a first adherend 40 and a second adherend 50 and heated and pressed, the second resin layer 20 flows out to the outside of the adherend 50, but since the first resin layer 10 having conductive particles 12 does not flow out and stays between the adherends 40 and 50, the number of the conductive particles nipped between first and second connection terminals 42 and 52 increases. COPYRIGHT: (C)2005,JPO&NCIPI |
