| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which is free from corrosion of an interconnect on a wiring board caused by moisture, chemicals or gas occluded at the wiring board or permeated through the wiring board, or which is excellent in high-frequency characteristics for the semiconductor package in which a semiconductor chip is mounted by facedown on the wiring board. SOLUTION: In the semiconductor package 10, the semiconductor chip 3 having a plurality of bump electrodes 4, and the wiring board 11 having a plurality of electrode pads 5 corresponding to the bump electrodes 4 are confronted each other. The bump electrodes 4 and the electrode pads 5 are electrically and mechanically connected by heating and pressurizing, the semiconductor chip 3 and the wiring board 11 are bonded by a liquid crystal polymer sheet 1, and a base material for the wiring board 11 comprises liquid crystal polymer. COPYRIGHT: (C)2005,JPO&NCIPI |
