| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of electronic components for forming a wiring pattern having improved adhesion properties with a base, and to provide the electronic component having such a wiring pattern. SOLUTION: The manufacturing method comprises a metal fine particle spraying process for spraying metal fine particles from a portion on the base, having an insulating pattern formed by a thermosetting resin, and adhering the metal fine particles on the insulating pattern; a heating process for heating the resin pattern for melting and sticking the metal fine patterns onto the resin pattern; and a metal fine particle removing process for removing the metal fine particles adhered onto the surface of the base except the resin pattern. COPYRIGHT: (C)2005,JPO&NCIPI
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