发明名称 |
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
摘要 |
A chemical mechanical polishing aqueous dispersion comprises abrasives (A) containing ceria, an anionic water-soluble polymer (B) and a cationic surfactant (C), wherein the amount of the anionic water-soluble polymer (B) is in the range of 60 to 600 parts by mass based on 100 parts by mass of the abrasives (A) containing ceria, and the amount of the cationic surfactant (C) is in the range of 0.1 to 100 ppm based on the whole amount of the chemical mechanical polishing aqueous dispersion.
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申请公布号 |
US2005164510(A1) |
申请公布日期 |
2005.07.28 |
申请号 |
US20050038190 |
申请日期 |
2005.01.21 |
申请人 |
JSR CORPORATION |
发明人 |
IKEDA NORIHIKO;NISHIMOTO KAZUO;HATTORI MASAYUKI;KAWAHASHI NOBUO |
分类号 |
C09G1/02;C09K3/14;H01L21/304;H01L21/306;H01L21/3105;(IPC1-7):H01L21/302;H01L21/461 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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